ASXNYSESemiconductors & Related DevicesUS GAAP · USD

ASE Technology Holding Co., Ltd.

ASE Technology Holding Co., Ltd. provides semiconductor assembly and test services, including wafer probing, final testing, packaging, and related materials support. Through its subsidiaries, the group also offers electronic manufacturing services, with operations and customers spanning Asia, the Americas, Europe, and other international markets.

Revenue645.4bn USD
+8.4 %y/y
Operating profit (EBIT)58.8bn USD
+21.2 %y/y
EBIT margin9.1%
+1.0 ppy/y
Net income40.0bn USD
+23.6 %y/y
Free cash flow-23.6bn USD
−359.2 %y/y

Fiscal year 2025 · change from previous year

Development 2022–2025

0200400600800bn USD2022: 670.9 bn USD2022: EBIT 85.8 bn USD20222023: 581.9 bn USD2023: EBIT 48.9 bn USD20232024: 595.4 bn USD2024: EBIT 48.5 bn USD20242025: 645.4 bn USD2025: EBIT 58.8 bn USD2025645.458.8
RevenueOperating profit (EBIT)

Business

Share of revenue
Assembly and Packaging45 %

Turnkey back-end semiconductor assembly and packaging services for chips.

Testing Services20 %

Wafer probing, final test, and related semiconductor test services.

Advanced Packaging15 %

Bumping, flip chip, wafer-level packaging, and system-in-package solutions.

Electronic Manufacturing Services15 %

EMS production and support for electronics customers through USI.

Materials and Other Services5 %

Supporting materials, process inputs, and ancillary manufacturing services.

Customers

ASE Technology serves semiconductor designers and integrated device companies that outsource assembly, test, and advanced packaging. Its EMS business also sells to electronics customers needing manufacturing, integration, and related production support. The company’s customer base is concentrated, with top customers contributing a large share of revenue, which reflects the importance of high-volume, long-term manufacturing relationships.

Fabless semiconductor companies

Buy assembly, test, and packaging capacity for outsourced chip production.

Integrated device manufacturers

Use the group for back-end manufacturing, testing, and packaging support.

Advanced packaging customers

Need bumping, flip chip, WLP, and SiP solutions for complex devices.

Electronics OEMs and system brands

Source EMS and product manufacturing services through USI.

Industrial and automotive electronics customers

Buy packaged, tested, and assembled components for reliability-focused applications.

Strategy

ASE Technology focuses on maintaining breadth across assembly, testing, advanced packaging, and EMS so it can serve customers across multiple chip and electronics categories. The company emphasizes technology development, capacity, and global reach because customers source back-end semiconductor services where scale, process capability, and supply continuity matter. Its strategy also relies on serving a diversified set of end markets, from communications and computing to automotive and industrial applications.

Expand advanced packaging capabilitiesMedium term

Advanced nodes and heterogeneous integration require more sophisticated back-end services.

Scale testing and assembly capacityShort term

Customers need dependable outsourced capacity for high-volume chip output.

Broaden end-market exposureMedium term

Serving communications, computing, automotive, and industrial demand diversifies revenue.

Maintain global manufacturing footprintLong term

Proximity to customer supply chains improves service and logistics resilience.

Geography

ASE Technology operates a broad manufacturing and customer footprint across Taiwan and multiple overseas markets, including China, South Korea, Japan, Southeast Asia, Mexico, Tunisia, the United States, and Europe. The business is globally distributed because semiconductor assembly, test, and EMS customers often require production close to supply chains, end markets, or electronics manufacturing hubs. Its geographic spread also exposes the company to cross-border logistics, trade policy, and foreign-exchange effects.

Risks

ASE Technology is exposed to cyclical semiconductor demand, high customer concentration, and intense competition in outsourced assembly and test. Its multinational footprint also creates exposure to trade restrictions, geopolitical tension across the Taiwan Strait, and foreign-exchange volatility, while advanced packaging investment raises execution and technology-obsolescence risk.

Sorted by severity
LowMediumHighLowMediumHighImpact →Likelihood →Customer concentration1Semiconductor demand cyclicality2Geopolitical and trade exposure3Technology and execution risk4Foreign exchange volatility5
Impact is the risk’s severity and likelihood how probable it is over the next few years, both assessed from the company’s reports. Numbers match the list.
  1. Customer concentrationImpact: HighLikelihood: High

    Top customers contributed a large share of net revenues, so loss or slowdown of key accounts would impact volumes.

    Exposure: Top 10 customers contributed 71% of 1Q26 net revenues and 69% of 2Q26 net revenues

  2. Semiconductor demand cyclicalityImpact: HighLikelihood: High

    Assembly, test, and EMS volumes depend on end-market chip demand and inventory cycles.

    Exposure: Communication and computing end markets

  3. Geopolitical and trade exposureImpact: HighLikelihood: Medium

    The company operates across Taiwan, China, the U.S., and other jurisdictions that can be affected by policy shifts.

    ExposureTaiwan StraitChinaUnited States
  4. Technology and execution riskImpact: MediumLikelihood: High

    Advanced packaging requires continuous process upgrades and successful scaling of new capabilities.

    ExposureBumpingFlip chipWLPSiP
  5. Foreign exchange volatilityImpact: MediumLikelihood: High

    A globally dispersed business with NT$ reporting is exposed to currency translation and transaction impacts.

    ExposureNT$US$Regional currencies

Accounting

Judgemental items
Foreign currency translation

The group reports in NT$ and translates financial statements into US$ for convenience, creating exchange-rate-driven volatility in comparability.

Impact: Reported figures can move with currency rates rather than underlying business performance.

Goodwill impairment

Goodwill is tested annually or when impairment indicators arise, and losses are recognized in profit or loss.

Impact: Can materially reduce earnings if acquired units underperform.

Intangible asset amortization

Finite-life intangibles are amortized based on estimated useful lives and reviewed periodically.

Impact: Useful-life changes affect expense recognition over time.

Seasonality and mix

Application mix across communications, computing, consumer, automotive, and industrial end markets can change quarterly.

Impact: Quarterly revenue and margin comparability can be affected by demand shifts.

Publicly listed companies with a comparable business focus.

Last updated: 28/09/2026