FABCNasdaqCommunications Services, NECUS GAAP · USD

Fabric.AI, Inc.

Fabric.AI, Inc. is a U.S.-based development-stage company focused on designing and developing fabless semiconductor technologies for AI data center infrastructure. Its reported work centers on MicroLED-based optical interconnect technology and the Neural I/o chip, with manufacturing intended to be outsourced to third-party partners.

Liikevaihto0,1milj. USD
+0,0 %v/v
Liikevoitto (EBIT)−10,5milj. USD
+46,0 %v/v
EBIT-marginaali−16 394,5%
+13 988,0 %-yks.v/v
Nettotulos−21,1milj. USD
−1 101,3 %v/v
Vapaa kassavirta−7,9milj. USD
+41,6 %v/v

Tilikausi 2025 · muutos edellisvuodesta

Kehitys 2020–2025

−40−30−20−10010milj. USD2020: 1,6 milj. USD2020: EBIT −10 milj. USD20202021: 2,7 milj. USD2021: EBIT −33 milj. USD20212022: 3,0 milj. USD2022: EBIT −23 milj. USD20222023: 0,50 milj. USD2023: EBIT −28 milj. USD20232024: 0,06 milj. USD2024: EBIT −19 milj. USD20242025: 0,06 milj. USD2025: EBIT −10 milj. USD20250,06−10
LiikevaihtoLiikevoitto (EBIT)

Liiketoiminta

Osuus liikevaihdosta
Optical interconnect technologies60 %

MicroLED-based interconnect products and related chip architectures for AI infrastructure.

Semiconductor chip development25 %

Design and engineering of the Neural I/o chip and related semiconductor IP.

Manufacturing and commercialization support15 %

Outsourced fabrication, qualification, and partner-led product commercialization.

Tuotteet

Raportoitu · osuus liikevaihdosta
67,7%30,6%FY2024100 %
  • Products67,7 %
  • Services30,6 %
  • Shipping and Handling1,7 %

Lähde: 10-K FY2024, yhtiön tuotelinjoittain raportoima liikevaihto (SEC XBRL). Osuudet on laskettu näytetyistä riveistä ja ne summautuvat 100 %:iin.

Asiakkaat

The company is targeting AI infrastructure and data center customers that need high-speed interconnect solutions, along with partners involved in semiconductor development and manufacturing. Its disclosed market focus suggests buyers would include data center operators, OEMs, and technology partners evaluating next-generation optical connectivity. Earlier disclosures also referenced commercial vehicle and mobility customers, but the current reported business direction is centered on semiconductor technologies.

AI infrastructure and data center operators

Buy interconnect technologies to improve bandwidth, latency, and system efficiency in AI workloads.

Semiconductor manufacturing partners

Support fabrication and qualification of fabless chip designs and related product introduction.

OEMs and system integrators

Evaluate the company's chip and interconnect solutions for incorporation into larger hardware platforms.

Potential licensing or strategic partners

May collaborate on commercialization, scaling, or technology integration.

Strategia

The company is prioritizing development and commercialization of its AI semiconductor platform, with emphasis on MicroLED-based optical interconnects and the Neural I/o chip. It is also dependent on external manufacturing and collaboration partners, so execution depends on successful qualification, supply-chain coordination, and eventual market acceptance.

Complete product development and prototype validationLyhyt aikaväli

Commercial revenue depends on proving the technical performance of the initial chip and interconnect platform.

Secure manufacturing and partner supportLyhyt aikaväli

A fabless model requires dependable third-party fabrication and assembly to move from design to product delivery.

Commercialize AI infrastructure solutionsKeskipitkä aikaväli

The company needs market acceptance from data center and infrastructure customers to create a scalable business.

Maantiede

Fabric.AI is headquartered in the United States and its business model depends on U.S.-based development and third-party manufacturing relationships. The company also highlights global semiconductor supply-chain exposure, especially Asia-based fabrication capacity, which affects sourcing, tariffs, and delivery timing. No authoritative revenue-by-country disclosure was provided in the excerpts.

Riskit

The company faces development-stage execution risk because its semiconductor products are not yet commercialized and may not meet performance or cost targets. It is also exposed to intense competition, supply-chain concentration in Asia, dependence on third-party manufacturers, and the need for additional capital to fund development.

Järjestetty vakavuuden mukaan
MatalaKohtalainenKorkeaMatalaKohtalainenKorkeaVaikutus →Todennäköisyys →Development-stage commercialization risk1Capital funding risk2Competitive pressure from established semiconductor companies3Third-party manufacturing dependence4Supply-chain and geopolitical risk5
Vaikutus on riskin vakavuus ja todennäköisyys sen toteutumisen todennäköisyys lähivuosina, molemmat arvioitu yhtiön raporttien perusteella. Numerot vastaavat listaa.
  1. Development-stage commercialization riskVaikutus: KriittinenTodennäköisyys: Korkea

    The company has not yet completed a prototype or generated semiconductor revenue, so product-market fit is unproven.

    Kohdistuu: Initial AI interconnect and chip products

  2. Capital funding riskVaikutus: KorkeaTodennäköisyys: Korkea

    R&D, qualification, and commercialization require additional capital, and financing may not be available on acceptable terms.

    Kohdistuu: Development and operating runway

  3. Competitive pressure from established semiconductor companiesVaikutus: KorkeaTodennäköisyys: Kohtalainen

    Larger rivals have greater R&D, manufacturing, and distribution resources and may bring superior products to market first.

    Kohdistuu: Optical interconnect and AI infrastructure markets

  4. Third-party manufacturing dependenceVaikutus: KorkeaTodennäköisyys: Kohtalainen

    As a fabless company, Fabric.AI depends on external manufacturers for fabrication, quality, and timing.

    Kohdistuu: Kopin Corporation and contract manufacturing partners

  5. Supply-chain and geopolitical riskVaikutus: KeskitasoTodennäköisyys: Kohtalainen

    Semiconductor manufacturing capacity is concentrated in Asia, making the company vulnerable to tariffs and disruptions.

    Kohdistuu: Fabrication and component sourcing

Kirjanpito

Harkinnanvaraiset erät
Derivative and warrant liability valuation

Reported earnings can be materially affected by mark-to-market changes in derivative and warrant fair values.

Vaikutus: Can create large non-cash gains or losses

Preferred stock and equity classification

Contingent redemption and anti-dilution features can move instruments between equity and mezzanine equity.

Vaikutus: Affects leverage, dilution, and equity presentation

Development-stage R&D expense recognition

Prototype engineering and contractor costs are expensed, shaping reported operating losses.

Vaikutus: High sensitivity to development activity

Transaction cost accounting for financings

Offering costs reduce net proceeds and can materially affect cash raised from equity placements.

Vaikutus: Impacts cash and equity balances

Julkisesti listattuja yhtiöitä, joilla on samankaltainen liiketoiminta.

Päivitetty: 24.9.2026