IMOSNasdaqSemiconductors & Related DevicesUS GAAP · USD

ChipMOS TECHNOLOGIES INC

ChipMOS TECHNOLOGIES INC. is a Taiwan-based outsourced semiconductor assembly and test (OSAT) company incorporated in the United States and listed on the Taiwan Stock Exchange and Nasdaq. It provides back-end semiconductor services for memory and logic chips from its facilities in Hsinchu Science Park, Hsinchu Industrial Park, and Southern Taiwan Science Park.

Revenue23.9bn USD
+5.5 %y/y
Operating profit (EBIT)892m USD
−53.7 %y/y
EBIT margin3.7%
−4.8 ppy/y
Net income551m USD
−61.7 %y/y
Free cash flow145m USD
−83.1 %y/y

Fiscal year 2025 · change from previous year

Development 2022–2025

0510152025bn USD2022: 23.5 bn USD2022: EBIT 4.2 bn USD20222023: 21.4 bn USD2023: EBIT 2.5 bn USD20232024: 22.7 bn USD2024: EBIT 1.9 bn USD20242025: 23.9 bn USD2025: EBIT 0.89 bn USD202523.90.89
RevenueOperating profit (EBIT)

Business

Share of revenue
Semiconductor assembly55 %

Packaging and assembly of semiconductor devices after wafer fabrication.

Semiconductor testing30 %

Electrical testing and reliability verification for chips and packages.

Memory OSAT services10 %

Assembly and test services for memory chips used in computing and storage.

Other semiconductor services5 %

Additional back-end support services for customer-specific semiconductor programs.

Customers

ChipMOS serves fabless semiconductor companies, integrated device manufacturers, and semiconductor foundries that outsource back-end assembly and test work. Its customers use these services to convert wafers into finished, qualified chips that can be shipped into end markets such as computing, storage, and consumer electronics.

Fabless semiconductor companies

They buy assembly and test capacity for chips they design but do not manufacture.

Integrated device manufacturers

They outsource selected back-end steps when internal capacity is constrained or specialized.

Independent foundries

They use ChipMOS for customer programs that need packaging and testing support.

Memory device customers

They buy assembly and test services for memory products tied to computing demand.

Logic semiconductor customers

They buy testing and packaging services for logic chips across multiple end markets.

Strategy

ChipMOS is investing in footprint expansion and adding capacity in line with committed customer demand, which helps it support long-term customer programs in a capital-intensive OSAT market. It is also working closely with customers to align service capacity with demand from memory and AI-linked semiconductor applications.

Capacity expansion aligned to demandShort term

OSAT economics depend on disciplined capital deployment and high equipment utilization.

Deepen customer relationshipsMedium term

Assembly and test programs are sticky when customers depend on qualified capacity and process control.

Capture memory-related growthMedium term

Memory demand can drive high utilization in specialized back-end capacity.

Geography

ChipMOS's operating footprint is concentrated in Taiwan, where its main facilities are located in Hsinchu Science Park, Hsinchu Industrial Park, and Southern Taiwan Science Park. Its customer base is described as serving end markets worldwide, so demand is tied to global semiconductor cycles even though production is largely Taiwan-based.

Risks

ChipMOS is exposed to semiconductor cycle volatility because assembly and test demand follows customer inventory, wafer starts, and end-market demand. Its Taiwan manufacturing concentration also creates operational, geopolitical, and supply-chain risk, while capital intensity means returns depend on utilization and disciplined capacity additions.

Sorted by severity
LowMediumHighLowMediumHighImpact →Likelihood →Semiconductor cycle volatility1Taiwan operating concentration2Customer demand mismatch3Geopolitical and supply-chain disruption4
Impact is the risk’s severity and likelihood how probable it is over the next few years, both assessed from the company’s reports. Numbers match the list.
  1. Semiconductor cycle volatilityImpact: HighLikelihood: High

    Assembly and test demand depends on chipmakers' production schedules and end-market inventory levels.

    Exposure: OSAT services for memory and logic customers

  2. Taiwan operating concentrationImpact: HighLikelihood: Medium

    Most facilities are located in Taiwan, so disruptions could affect manufacturing continuity and shipping.

    ExposureHsinchu Science ParkHsinchu Industrial ParkSouthern Taiwan Science Park
  3. Customer demand mismatchImpact: HighLikelihood: Medium

    The company adds capacity based on expected demand; if customer ramp timing slips, utilization can weaken.

    Exposure: New capacity and footprint expansion

  4. Geopolitical and supply-chain disruptionImpact: HighLikelihood: Medium

    Taiwan-centered manufacturing can be affected by regional tensions, logistics issues, or input shortages.

    Exposure: Export-oriented semiconductor operations

Accounting

Judgemental items
Revenue recognition timing

OSAT revenue depends on when assembly and test services are completed and accepted by customers.

Impact: Can shift reported quarterly revenue between periods

Capacity utilization and fixed-cost absorption

Manufacturing overhead is spread across output, so underutilization can pressure reported margins.

Impact: Affects gross profit and operating leverage

Property, plant and equipment

Expansion in semiconductor manufacturing requires substantial equipment and facility investment.

Impact: Depreciation and potential impairment are key judgments

Foreign currency translation

Operations are in Taiwan while filings and investor reporting include U.S. dollar references.

Impact: Can affect reported revenue and comparability across periods

Publicly listed companies with a comparable business focus.

Last updated: 28/09/2026